Product Specifications

Computing Features
- 3.0GHz Intel^® Xeon^® E3 (Kaby Lake, 7th Generation Core™) processor with 4 Cores and Turbo Boost 2.0; 8MB of Smart Cache (E3-15xxM V6)
- Up to 64GB of DDR4 memory with ECC
- Three-head Intel^® HD Graphics P630 with GT2, 8-bit VP9 8-bit CODEC, 10-bit HEVC (H.265) CODEC
- Support for DirectX 11/12, OpenGL 4.3/4.4, ES 2.0, and OCL 2.x - Optional fixed mSATA SSD for OS boot (optional encrypt/secure erase/write-protect)
- Intel^® Virtualization Technology (VT-x/VT-d) and Trusted Execution Technology (TXT)
- Intel Enhanced SpeedStep Technology and configurable TDP (cTDP) for improved thermal management
- Encryption and security via Intel® AES-NI encryption and Trusted Platform Module 2.0 (TPM)

I/O and Expansion Options
- Two 10Gigabit Ethernet ports with TCP/IP Offloading Engine (TOE)
- Two Gigabit Ethernet ports with TCP/IP Offloading Engine (TOE)
- One buffered SATA port
- Line-In, Headphone-Out, and Mic-In
- Two USB 3.0 ports
- Two USB 2.0 ports
- Two Serial Ports with RS-232/422/485 options
- Four buffered GPIO lines with interrupt capabilities
- One USB port to front for diagnostics and configuration
- One SAM™ sites for custom I/O (MIL-STD-1553, Wi-Fi/BT, GPS, etc.)
- 32MB of BIOS Flash for system parameters and user data
- Real Time Clock (RTC) with internal or no battery operation
- CPU temperature and voltage monitoring for safe operation
- Two x4 PCIe lanes to VPX-P1, configurable as transparent or blocking
- Two x1 PCIe lanes to VPX-P2 for additional system I/O
- Conduction-cooled module, fully compliant to OpenVPX 3U, VITA 46/47/48 standards
- +3.3V, +5V and +12V operation

SWaP-E (Size, Weight and Power – Efficiency)
- Greatest computing density, cores and RAM in one 3U OpenVPX card
- Ultra-low SWaP for 3U, 5 lbs. and as low as 60W
- MIL-STD-810G, MIL-S-901D, DO-160D, MIL-STD-461E compliant
- Operates up to extended temp -40°C to +85°C (Optional)
- Available in ruggedization levels R1-R5