Product Specifications

Computing Features
- 3.0GHz Intel^® Xeon^® E3 (Kaby Lake, 7th Generation Core™) processor with 4 Cores and Turbo Boost 2.0; 8MB of Smart Cache (E3-15xxM V6)
- Up to 64GB of DDR4 memory with ECC
- 3-head Intel^® HD Graphics P630 with GT2, 8-bit VP9 8-bit CODEC, 10-bit HEVC (H.265) CODEC
- Support for DirectX 11/12, OpenGL 4.3/4.4, ES 2.0, and OCL 2.x
- Video resolution up to 4096 x 2304 (4K and UHD) at 60Hz via DisplayPort
- One removable, fully sealed SSD canister with over 20,000 insertion cycles
- Canister includes up to four 2.5” SATA or NVMe SSDs (optional encrypt/secure erase/write-protect)
- Canister drive bay is sealed even when canister is removed
- Optional fixed M.2 SSD for OS boot (optional encrypt/secure erase/write-protect)
- Support for future Intel^® OPTANE™ M.2 memory
- Intel^® Virtualization Technology (VT-x/VT-d) and Trusted Execution Technology (TXT)
- Intel Enhanced SpeedStep Technology and configurable TDP (cTDP) for improved thermal management
- Encryption and security via Intel^® AES-NI encryption and Trusted Platform Module 2.0 (TPM)

I/O and Expansion Options
- Two 10Gigabit Ethernet ports (Copper)
- Three 1 Gigabit Ethernet ports with TCP/IP offloading (TOE)
- Three USB 3.0 ports
- Four USB 2.0 ports
- Two Serial ports with RS-232/422/485 options
- Choice of either conventional VGA/DisplayPort/HDMI or VGA/SMPTE video
- Three of any combination of: 1 VGA video port, 3 DisplayPort, or 3 HDMI 1.4
- 1 VGA and 2 HD-SDI (SMPTE 425-3/425-5)
- Optional custom video configurations for SMPTE SG-SDI (dual-channel 424M)
- Eight buffered Digital I/O (DIO) lines
- HD Audio with Mic, Headphones and Amplified Mono Speaker Out
- Two SAM™ sites for custom I/O (MIL-STD-1553, Wi-Fi/BT, GPS, etc.)
- 32 MB BIOS with optional write-protect
- Real Time Clock (RTC) with field-replaceable battery
- Trusted Platform Module (TPM) 2.0 for secure boot operation
- Panic/Tamper support for system Zeroize via Secure Erase of mass storage and BIOS (optional)

SWaP-E (Size, Weight and Power – Efficiency)
- Greatest computing density, cores, RAM and storage in one footprint
- Ultra-low SWaP at 5.4” x 6.5” x 5.25”, @ 7 lbs. and as low as 70W
- MIL-STD-810G, MIL-STD-1275D, MIL-S-901D, DO-160D, MIL-STD-461E, IP66 compliant
- Operates up to extended temp -40°C to +85°C (Optional)
- Available in ruggedization levels R1-R5