Product Specifications

Computing Features
- Intel^® Xeon^® processor D with up to 16 Cores (12 Cores standard); up to 12MB of Cache (D-15xx)
- Up to 64GB of DDR4 memory with ECC
- Supports optional AMD Radeon™ embedded GPU E8860, up to 768 GFLOPS
- Supports optional NVIDIA™ embedded GPU M2000M, up to 1.32 TFLOPS
- Optional fixed M.2 SSD for OS boot (optional encrypt/secure erase/write-protect)
- One removable 2.5” SATA/NVMe SSD or one removable canister (optional encrypt/secure erase/write-protect)
- Canister fully seals SSDs with a rugged mating connector allowing over 20,000 insertion cycles
- Canister includes up to four 2.5” SATA or NVMe SSDs (optional encrypt/secure erase/write-protect)
- Drive bay is sealed even when canister is removed
- Intel^® Virtualization Technology (VT-x/VT-d2) and Trusted Execution Technology (TXT)

I/O and Expansion Options
- Two 10 Gigabit Ethernet ports (Copper)
- Three Gigabit Ethernet ports with TCP/IP offloading for system management
- Three USB 3.0 ports
- Four USB 2.0 ports
- One DVI/VGA port
- Two Serial ports with RS-232/422/485 options
- Four DisplayPort and two SMPTE 292M SDI out via mini-BNC connectors from MXM module
- Eight buffered Digital I/O (DIO) lines
- Two SAM™ sites for custom I/O (MIL-STD-1553, Wi-Fi/BT, GPS, etc.)
- 32MB flash BIOS with optional write-protect/secure erase and battery-less operation
- Real Time Clock (RTC) with field-replaceable battery
- Trusted Platform Module (TPM) 2.0 for secure operation
- Panic support for system Zeroize via Secure Erase of mass storage and BIOS (optional)

SWaP-E (Size, Weight and Power – Efficiency)
- Industry’s highest computing density, graphics processing, cores, RAM and storage in one footprint
- Ultra-low SWaP at 5.4” x 6.5” x 3.5”, @ 7 lbs. and as low as 80W
- MIL-STD-810G, MIL-STD-1275D, MIL-S-901D, DO-160D, MIL-STD-461E, IP66 compliant
- Operates up to extended temp -40°C to +85°C (Optional)
- Available in ruggedization levels R1-R5