Product Specifications

Computing Features

- Rugged server intended for local data processing, storage, video, networking and I/O
- Designed with Intel^®’s highest performance, server-class, embedded processor and chipset
- Intel^® Xeon™ Broadwell-EP CPU up to 18 cores operating up to 2.1GHz (Xeon^® E5-26xx v4)
- Support for Hyper-Threading on each core for total of 36 logical cores
- Supports up to 256GB of DDR4 memory with ECC
- Up to four removable 2.5” SATA or NVMe SSD drives (optional encrypt/secure erase/write-protect)
- Fixed M.2 SATA or NVMe SSD for OS boot (optional encrypt/secure erase/write-protect)
- Optional fixed single or dual mSATA drives (lose SAM I/O™)
- Optional AMD^® Radeon^® embedded GPU E8860, up to 768 GFLOPS
- Optional NVIDIA^® Quadro^® GPU M2000M, up to 1.32 TFLOPS
- Intel® Virtualization Technology (VT-x/VT-d2) and Trusted Execution Technology (TXT)
- Trusted Platform Module (TPM) 2.0 for secure operation
- Converged Platform Power Management (CPPM) for power saving

I/O and Expansion Options

- One Gigabit Ethernet port with TCP/IP offloading for system management
- Optional intelligent Layer 2/3 Ethernet Switch with dual 10GbE ports and 4, 8, or 12 One Gigabit Ethernet ports
- Optional two additional 10 Gigabit Ethernet ports (totaling four when equipped with Switch)
- Optional additional 12 one Gigabit Ethernet ports (totaling 24 one Gigabit Ethernet ports)
- Four USB 2.0 ports - Two Serial ports with RS-232/422/485 options
- Eight GPIO lines for user-defined control
- One console video port up to 1920 x 1080 via DVI or VGA
- Optional two HD-SDI SMPTE 292M video out via mini-BNC from MXM module site
- Two SAM I/O™ sites for additional I/O (lose mSATA SSD)
- One XMC, MXM, SAM I/O™ site for additional I/O
- 16MB flash BIOS with optional write-protect/secure erase and battery-less operation
- Real Time Clock (RTC) with field-replaceable battery
- Panic support for system Zeroize via Secure Erase of mass storage, BIOS and Ethernet switch (optional)

SWaP-E (Size, Weight and Power – Efficiency)

- Greatest computing density, most number of embedded cores and RAM in the industry
- Ultra-low SWaP only 11.75” x 7.75” x 2.0” @ 10 lb. and as low as 175W
- MIL-STD 810G, MIL-STD 1275D, MIL-S-901D, DO-160D, MIL-STD 461F, up to IP66 compliant
- Operates up to extended temp -40°C to +85°C (Optional)
- Available in ruggedization levels R1-R5